HiSilicon Kirin 810 gegen HiSilicon Kirin 820 5G. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generation
  6 6
• CPU Gruppe
  HiSilicon Kirin 810/820 HiSilicon Kirin 810/820

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.90 GHz 1.84 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.20 GHz 2.36 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.20 GHz 2.36 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 4x Cortex-A76
• B core
  6x Cortex-A55 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G52 MP6 ARM Mali-G57 MP6
• GPU frequency
  0.85 GHz 0.85 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  16 6
• Shader
  288 96
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Bifrost 2 Vallhall 1
• DirectX Version
  12 12
• technisches verfahren
  12 nm 7 nm
• Datum der Veröffentlichung
  Q1/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nein Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 820 5G und HiSilicon Kirin 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR4X-2133
• Max. Speicher
  6 GB
• ECC
  Nein Nein
• Speicherkanäle
  4 4

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 810 und HiSilicon Kirin 820 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 6 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 810 und HiSilicon Kirin 820 5G, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L3-Cache
  1.00 MB 2.00 MB
• Architektur
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• technisches verfahren
  7 nm 7 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2019 Q2/2019