Qualcomm Snapdragon 730 contro Qualcomm Snapdragon 845. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Gruppo CPU
  Qualcomm Snapdragon 730 Qualcomm Snapdragon 845
• Segmento
  Mobile Mobile
• Generazione
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenza
  1.80 GHz 1.80 GHz
• Turbo (1 Core)
  2.20 GHz 2.80 GHz
• Turbo (8 Cores)
  2.20 GHz 2.80 GHz
• Hyperthreading
  No No
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  Qualcomm Adreno 618 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Shader
  128 256
• Max. GPU Memory
  4 GB 8 GB
• Max. displays
  2 2
• Generazione
  6 4
• Processo tecnico
  14 nm 10 nm
• Data di rilascio
  Q2/2019 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  No No
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 845 e Qualcomm Snapdragon 730. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memoria
  8 GB 8 GB
• Canali di memoria
  2 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 730 e Qualcomm Snapdragon 845 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 730 e Qualcomm Snapdragon 845, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 0.51 MB
• L3-Cache
  -- 2.00 MB
• Architettura
  Kryo 470 Gold/475 Silver Kryo 385
• Processo tecnico
  8 nm 10 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q2/2019 Q1/2018
• Part Number
  SM7150-AA SDM845