Qualcomm Snapdragon 730 kontra Qualcomm Snapdragon 845. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Grupa CPU
  Qualcomm Snapdragon 730 Qualcomm Snapdragon 845
• Segment
  Mobile Mobile
• Pokolenie
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Częstotliwość
  1.80 GHz 1.80 GHz
• Turbo (1 rdzeń)
  2.20 GHz 2.80 GHz
• Turbo (8 Cores)
  2.20 GHz 2.80 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 618 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Shader
  128 256
• Max. GPU Memory
  4 GB 8 GB
• Max. displays
  2 2
• Pokolenie
  6 4
• Proces technologiczny
  14 nm 10 nm
• Data wydania
  Q2/2019 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  Nie Nie
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 845 oraz Qualcomm Snapdragon 730. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-1866 LPDDR4X-1866
• Max. Pamięć
  8 GB 8 GB
• Kanały pamięci
  2 4
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 730 oraz Qualcomm Snapdragon 845 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 730 oraz Qualcomm Snapdragon 845, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 0.51 MB
• L3-Cache
  -- 2.00 MB
• Architektura
  Kryo 470 Gold/475 Silver Kryo 385
• Proces technologiczny
  8 nm 10 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2019 Q1/2018
• Part Number
  SM7150-AA SDM845