Qualcomm Snapdragon 855 Plus 対 Apple A12 Bionic. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Qualcomm Snapdragon Apple A series
• CPUグループ
  Qualcomm Snapdragon 855/860 Apple A12/A12X/A12Z
• セグメント
  Mobile Mobile
• 世代
  6 12
• 過去のモデル
  -- Apple A11 Bionic
• Successor
  Qualcomm Snapdragon 860 Apple A13 Bionic

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• コア・アーキテクチャ
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 640 Apple A12
• GPU frequency
  0.25 GHz 1.59 GHz
• GPU (Turbo)
  0.68 GHz 2.49 GHz
• 実行部隊
  4 4
• シェーダー
  384 0
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• 世代
  5 9
• ぎじゅつてきなかだい
  7 nm 7 nm
• 発売日
  Q1/2019 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode
• VC-1
  いいえ Decode
• JPEG
  いいえ Decode / Encode

Overview of the types and quantities of RAM supported by Apple A12 Bionic と Qualcomm Snapdragon 855 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-4266 LPDDR4X-4266
• マックス メモリ
  16 GB 16 GB
• メモリーチャンネル
  4 1
• ECC
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 Plus と Apple A12 Bionic to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 Plus と Apple A12 Bionic, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• L2-Cache
  2.00 MB 8.00 MB
• L3-Cache
  3.00 MB --
• 建築
  Kryo 485 A12
• ぎじゅつてきなかだい
  7 nm 7 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q4/2018 Q3/2018
• Part Number
  SM8150-AC --