Qualcomm Snapdragon 855 Plus 对 Apple A12 Bionic. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Apple A series
• CPU组
  Qualcomm Snapdragon 855/860 Apple A12/A12X/A12Z
• 分段
  Mobile Mobile
• 一代人
  6 12
• 过去的模式
  -- Apple A11 Bionic
• Successor
  Qualcomm Snapdragon 860 Apple A13 Bionic

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 640 Apple A12
• GPU frequency
  0.25 GHz 1.59 GHz
• GPU (Turbo)
  0.68 GHz 2.49 GHz
• 执行单位
  4 4
• 着色器
  384 0
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• 一代人
  5 9
• 技术过程
  7 nm 7 nm
• 发布日期
  Q1/2019 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Apple A12 Bionic 和 Qualcomm Snapdragon 855 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266 LPDDR4X-4266
• 最大内存
  16 GB 16 GB
• 记忆通道
  4 1
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 Plus 和 Apple A12 Bionic to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 Plus 和 Apple A12 Bionic, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• L2-Cache
  2.00 MB 8.00 MB
• L2-Cache
  3.00 MB --
• 建筑学
  Kryo 485 A12
• 技术过程
  7 nm 7 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q4/2018 Q3/2018
• Part Number
  SM8150-AC --