HiSilicon Kirin 960 vs Qualcomm Snapdragon 810 v2. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  HiSilicon Kirin Qualcomm Snapdragon
• 세대
  5 2
• CPU 그룹
  HiSilicon Kirin 960 Qualcomm Snapdragon 808/810

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.80 GHz 1.50 GHz
• Turbo (1 Core)
  2.40 GHz 2.00 GHz
• Turbo (8 Cores)
  2.40 GHz 2.00 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G71 MP8 Qualcomm Adreno 430
• GPU frequency
  0.90 GHz 0.63 GHz
• GPU (Turbo)
  터보 없음 0.63 GHz
• 실행 단위
  8 0
• Shader
  256 256
• Max. GPU Memory
  2 GB --
• Max. displays
  2 0
• 세대
  Bifrost 1 4
• 기술
  16 nm 20 nm
• 릴리스 날짜
  Q2/2016 Q2/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode 아니요
• h264
  Decode / Encode Decode / Encode
• VP9
  아니요 아니요
• VP8
  Decode / Encode 아니요
• AV1
  아니요 아니요
• AVC
  Decode / Encode 아니요
• VC-1
  아니요 Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 810 v2 그리고 HiSilicon Kirin 960. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4-1600 LPDDR4-1600
• 최대. Memory
  6 GB
• ECC
  아니요 아니요
• 메모리 채널
  2 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 960 그리고 Qualcomm Snapdragon 810 v2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 960 그리고 Qualcomm Snapdragon 810 v2, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• L3-Cache
  4.00 MB --
• 아키텍처
  Cortex-A73 / Cortex-A53 Cortex-A57 / Cortex-A53
• 기술
  16 nm 20 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q4/2016 2015
• Part Number
  -- MSM8994v2