HiSilicon Kirin 960 对 Qualcomm Snapdragon 810 v2. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  HiSilicon Kirin Qualcomm Snapdragon
• 一代人
  5 2
• CPU组
  HiSilicon Kirin 960 Qualcomm Snapdragon 808/810

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.80 GHz 1.50 GHz
• 涡轮增压 (1核)
  2.40 GHz 2.00 GHz
• Turbo (8 Cores)
  2.40 GHz 2.00 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G71 MP8 Qualcomm Adreno 430
• GPU frequency
  0.90 GHz 0.63 GHz
• GPU (Turbo)
  没有涡轮增压 0.63 GHz
• 执行单位
  8 0
• 着色器
  256 256
• Max. GPU Memory
  2 GB --
• Max. displays
  2 0
• 一代人
  Bifrost 1 4
• 技术过程
  16 nm 20 nm
• 发布日期
  Q2/2016 Q2/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode 没有
• h264
  Decode / Encode Decode / Encode
• VP9
  没有 没有
• VP8
  Decode / Encode 没有
• AV1
  没有 没有
• AVC
  Decode / Encode 没有
• VC-1
  没有 Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 810 v2 和 HiSilicon Kirin 960. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4-1600 LPDDR4-1600
• 最大内存
  6 GB
• ECC
  没有 没有
• 记忆通道
  2 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 960 和 Qualcomm Snapdragon 810 v2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 960 和 Qualcomm Snapdragon 810 v2, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  4.00 MB --
• 建筑学
  Cortex-A73 / Cortex-A53 Cortex-A57 / Cortex-A53
• 技术过程
  16 nm 20 nm
• 插座
  N/A N/A
• 发布日期
  Q4/2016 2015
• Part Number
  -- MSM8994v2