Qualcomm Snapdragon 410 vs MediaTek Helio G85. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Qualcomm Snapdragon Mediatek Helio
• CPU 그룹
  Qualcomm Snapdragon 410 MediaTek Helio G70/G80
• 세그먼트
  Mobile Mobile
• 세대
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 핵심 아키텍처
  normal hybrid (big.LITTLE)
• 빈도
  1.20 GHz 1.80 GHz
• Turbo (1 Core)
  1.20 GHz 2.00 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 306 ARM Mali-G52 MP2
• GPU frequency
  0.40 GHz 1.00 GHz
• GPU (Turbo)
  0.40 GHz 터보 없음
• 실행 단위
  0 2
• Shader
  24 32
• Max. displays
  0 2
• 세대
  3 Bifrost 2
• 기술
  28 nm 16 nm
• 릴리스 날짜
  Q3/2012 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  아니요 Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  아니요 Decode / Encode
• VP9
  아니요 Decode / Encode
• AV1
  아니요 아니요
• AVC
  아니요 Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G85 그리고 Qualcomm Snapdragon 410. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR2-533LPDDR3-533 LPDDR4X-1800
• 최대. Memory
  8 GB
• 메모리 채널
  1 2
• ECC
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 410 그리고 MediaTek Helio G85 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 410 그리고 MediaTek Helio G85, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA 확장
  --
• 아키텍처
  Cortex-A53 Cortex-A75 / Cortex-A55
• 기술
  28 nm 12 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  2014 Q2/2020
• Part Number
  APQ8016 MT6769Z