Qualcomm Snapdragon 410 kontra MediaTek Helio G85. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon Mediatek Helio
• Grupa CPU
  Qualcomm Snapdragon 410 MediaTek Helio G70/G80
• Segment
  Mobile Mobile
• Pokolenie
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  normal hybrid (big.LITTLE)
• Częstotliwość
  1.20 GHz 1.80 GHz
• Turbo (1 rdzeń)
  1.20 GHz 2.00 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 306 ARM Mali-G52 MP2
• GPU frequency
  0.40 GHz 1.00 GHz
• GPU (Turbo)
  0.40 GHz No turbo
• Jednostki wykonawcze
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• Shader
  24 32
• Max. displays
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• Pokolenie
  3 Bifrost 2
• Proces technologiczny
  28 nm 16 nm
• Data wydania
  Q3/2012 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G85 oraz Qualcomm Snapdragon 410. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR2-533LPDDR3-533 LPDDR4X-1800
• Max. Pamięć
  8 GB
• Kanały pamięci
  1 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 410 oraz MediaTek Helio G85 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 410 oraz MediaTek Helio G85, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Rozszerzenia ISA
  --
• Architektura
  Cortex-A53 Cortex-A75 / Cortex-A55
• Proces technologiczny
  28 nm 12 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  2014 Q2/2020
• Part Number
  APQ8016 MT6769Z