Qualcomm Snapdragon 870 vs MediaTek Dimensity 9000 Plus. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Qualcomm Snapdragon Mediatek Dimensity
• 세대
  7 3
• CPU 그룹
  Qualcomm Snapdragon 865/870 MediaTek Dimensity 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 650 ARM Mali-G710 MP10
• GPU frequency
  0.25 GHz 0.90 GHz
• GPU (Turbo)
  0.67 GHz 터보 없음
• 실행 단위
  2 10
• Shader
  512 0
• Max. displays
  1 1
• 세대
  6 Vallhall 3
• 기술
  7 nm 4 nm
• 릴리스 날짜
  Q4/2019 Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  아니요 Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 9000 Plus 그리고 Qualcomm Snapdragon 870. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-4266LPDDR5-5500 LPDDR5-7500
• 최대. Memory
  16 GB
• ECC
  아니요 아니요
• 메모리 채널
  4 4

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 870 그리고 MediaTek Dimensity 9000 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 870 그리고 MediaTek Dimensity 9000 Plus, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• 가상화
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• 아키텍처
  Kryo 585 Cortex-X2 / -A710 / -A510
• 기술
  7 nm 4 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q2/2021 Q3/2022
• Part Number
  SM8250-AC MT6983