Qualcomm Snapdragon 870 对 MediaTek Dimensity 9000 Plus. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Qualcomm Snapdragon Mediatek Dimensity
• 一代人
  7 3
• CPU组
  Qualcomm Snapdragon 865/870 MediaTek Dimensity 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 超频
  没有 没有
• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 650 ARM Mali-G710 MP10
• GPU frequency
  0.25 GHz 0.90 GHz
• GPU (Turbo)
  0.67 GHz 没有涡轮增压
• 执行单位
  2 10
• 着色器
  512 0
• Max. displays
  1 1
• 一代人
  6 Vallhall 3
• 技术过程
  7 nm 4 nm
• 发布日期
  Q4/2019 Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  没有 Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 9000 Plus 和 Qualcomm Snapdragon 870. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266LPDDR5-5500 LPDDR5-7500
• 最大内存
  16 GB
• ECC
  没有 没有
• 记忆通道
  4 4

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 870 和 MediaTek Dimensity 9000 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 870 和 MediaTek Dimensity 9000 Plus, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  2.00 MB --
• L2-Cache
  3.00 MB --
• 建筑学
  Kryo 585 Cortex-X2 / -A710 / -A510
• 技术过程
  7 nm 4 nm
• 插座
  N/A N/A
• 发布日期
  Q2/2021 Q3/2022
• Part Number
  SM8250-AC MT6983