HiSilicon Kirin 820E 5G kontra HiSilicon Kirin 970. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin HiSilicon Kirin
• Pokolenie
  6 6
• Grupa CPU
  HiSilicon Kirin 810/820 HiSilicon Kirin 970

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.84 GHz 1.84 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.22 GHz 2.40 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.84 GHz 2.40 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  3x Cortex-A76 4x Cortex-A73
• B core
  3x Cortex-A55 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G57 MP6 ARM Mali-G72 MP12
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  6 12
• Shader
  96 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  2 1
• Pokolenie
  Vallhall 1 Bifrost 2
• DirectX Version
  12 12
• Proces technologiczny
  7 nm 16 nm
• Data wydania
  Q2/2020 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode Nie
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 970 oraz HiSilicon Kirin 820E 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-2133 LPDDR4X-2133
• Max. Pamięć
  8 GB
• ECC
  Nie Nie
• Kanały pamięci
  4 4

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 820E 5G oraz HiSilicon Kirin 970 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W 9 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 820E 5G oraz HiSilicon Kirin 970, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L3-Cache
  2.00 MB 2.00 MB
• Architektura
  Cortex-A76 / Cortex-A55 Cortex-A73 / Cortex-A53
• Proces technologiczny
  7 nm 10 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2021 Q3/2017