Intel Atom x7-Z8700 kontra HiSilicon Kirin 925. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Intel Atom HiSilicon Kirin
• Pokolenie
  1 2
• Grupa CPU
  Intel Atom x3/x5/x7 HiSilicon Kirin 920

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.60 GHz 1.30 GHz
• Rdzenie CPU
  4 8
• Turbo (1 rdzeń)
  2.40 GHz 1.80 GHz
• CPU Threads
  4 8
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A15
• B core
  -- 4x Cortex-A7

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Intel HD Graphics 405 (16EU) ARM Mali-T628 MP4
• GPU frequency
  0.20 GHz 0.60 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Jednostki wykonawcze
  16 4
• Shader
  128 64
• Max. GPU Memory
  8 GB --
• Max. displays
  3 1
• Pokolenie
  8 Midgard 2
• DirectX Version
  12 11
• Proces technologiczny
  14 nm 32nm
• Data wydania
  Q2/2015 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Decode Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode / Encode Nie
• VC-1
  Decode Nie
• JPEG
  Decode Nie

Overview of the types and quantities of RAM supported by HiSilicon Kirin 925 oraz Intel Atom x7-Z8700. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-1600 LPDDR3-1600
• ECC
  Nie Nie
• Kanały pamięci
  2 2
• Wersja PCIe
  2.0
• Pasma PCIe
  2

• AES-NI
  Tak Nie

Analyze the TDP (Thermal Design Power) requirements of Intel Atom x7-Z8700 oraz HiSilicon Kirin 925 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  2 W

Information on architecture, interfaces, and additional instructions supported by Intel Atom x7-Z8700 oraz HiSilicon Kirin 925, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) ARMv7-A32 (32 bit)
• Wirtualizacja
  VT-x, VT-x EPT None
• Rozszerzenia ISA
  SSE4.1, SSE4.2
• L3-Cache
  2.00 MB --
• Architektura
  Cherry Trail Cortex-A15 / Cortex-A7
• Proces technologiczny
  14 nm 28 nm
• Gniazdo
  BGA 138 N/A
• Data wydania
  Q1/2015 Q3/2014