Intel Atom x7-Z8700 gegen HiSilicon Kirin 925. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Intel Atom HiSilicon Kirin
• Generation
  1 2
• CPU Gruppe
  Intel Atom x3/x5/x7 HiSilicon Kirin 920

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.60 GHz 1.30 GHz
• CPU Kerne
  4 8
• Turbo (1 Kern)
  2.40 GHz 1.80 GHz
• CPU Threads
  4 8
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A15
• B core
  -- 4x Cortex-A7

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Intel HD Graphics 405 (16EU) ARM Mali-T628 MP4
• GPU frequency
  0.20 GHz 0.60 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Ausführungseinheiten
  16 4
• Shader
  128 64
• Max. GPU Memory
  8 GB --
• Max. displays
  3 1
• Generation
  8 Midgard 2
• DirectX Version
  12 11
• technisches verfahren
  14 nm 32nm
• Datum der Veröffentlichung
  Q2/2015 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Decode / Encode Decode / Encode
• VP9
  Nein Nein
• VP8
  Decode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode / Encode Nein
• VC-1
  Decode Nein
• JPEG
  Decode Nein

Overview of the types and quantities of RAM supported by HiSilicon Kirin 925 und Intel Atom x7-Z8700. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-1600 LPDDR3-1600
• ECC
  Nein Nein
• Speicherkanäle
  2 2
• PCIe-Version
  2.0
• PCIe-Lanes
  2

• AES-NI
  Ja Nein

Analyze the TDP (Thermal Design Power) requirements of Intel Atom x7-Z8700 und HiSilicon Kirin 925 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  2 W

Information on architecture, interfaces, and additional instructions supported by Intel Atom x7-Z8700 und HiSilicon Kirin 925, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) ARMv7-A32 (32 bit)
• Virtualisierung
  VT-x, VT-x EPT None
• ISA-Erweiterungen
  SSE4.1, SSE4.2
• L3-Cache
  2.00 MB --
• Architektur
  Cherry Trail Cortex-A15 / Cortex-A7
• technisches verfahren
  14 nm 28 nm
• Steckdose
  BGA 138 N/A
• Datum der Veröffentlichung
  Q1/2015 Q3/2014