MediaTek Helio G88 kontra MediaTek Kompanio 1300T. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Mediatek Helio Mediatek Kompanio
• Pokolenie
  1 3
• Grupa CPU
  MediaTek Helio G70/G80 MediaTek Kompanio 900/1200/1300

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G52 MP2 ARM Mali-G77 MP9
• GPU frequency
  1.00 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  2 9
• Shader
  32 144
• Max. GPU Memory
  -- 4 GB
• Max. displays
  2 1
• Pokolenie
  Bifrost 2 Vallhall 1
• Proces technologiczny
  16 nm 7 nm
• Data wydania
  Q3/2020 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Kompanio 1300T oraz MediaTek Helio G88. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-1800 LPDDR4X
• Max. Pamięć
  8 GB
• ECC
  Nie Nie
• Kanały pamięci
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G88 oraz MediaTek Kompanio 1300T to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G88 oraz MediaTek Kompanio 1300T, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Rozszerzenia ISA
  --
• Architektura
  Cortex-A75 / Cortex-A55 Cortex-A78 / Cortex-A55
• Proces technologiczny
  12 nm 6 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2020 Q3/2021
• Part Number
  MT6769Z MT8797