MediaTek Kompanio 1300T kontra Qualcomm Snapdragon 870. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Kompanio Qualcomm Snapdragon
• Grupa CPU
  MediaTek Kompanio 900/1200/1300 Qualcomm Snapdragon 865/870
• Segment
  Mobile Mobile
• Pokolenie
  3 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G77 MP9 Qualcomm Adreno 650
• GPU frequency
  0.25 GHz
• GPU (Turbo)
  No turbo 0.67 GHz
• Jednostki wykonawcze
  9 2
• Shader
  144 512
• Max. GPU Memory
  4 GB --
• Max. displays
  1 1
• Pokolenie
  Vallhall 1 6
• Proces technologiczny
  7 nm 7 nm
• Data wydania
  Q2/2019 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Nie
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 oraz MediaTek Kompanio 1300T. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X LPDDR4X-4266LPDDR5-5500
• Max. Pamięć
  16 GB
• Kanały pamięci
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 4
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Kompanio 1300T oraz Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Kompanio 1300T oraz Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• Architektura
  Cortex-A78 / Cortex-A55 Kryo 585
• Proces technologiczny
  6 nm 7 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2021 Q2/2021
• Part Number
  MT8797 SM8250-AC