MediaTek Kompanio 1300T 对 Qualcomm Snapdragon 870. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Mediatek Kompanio Qualcomm Snapdragon
• CPU组
  MediaTek Kompanio 900/1200/1300 Qualcomm Snapdragon 865/870
• 分段
  Mobile Mobile
• 一代人
  3 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G77 MP9 Qualcomm Adreno 650
• GPU frequency
  0.25 GHz
• GPU (Turbo)
  没有涡轮增压 0.67 GHz
• 执行单位
  9 2
• 着色器
  144 512
• Max. GPU Memory
  4 GB --
• Max. displays
  1 1
• 一代人
  Vallhall 1 6
• 技术过程
  7 nm 7 nm
• 发布日期
  Q2/2019 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode 没有
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 和 MediaTek Kompanio 1300T. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X LPDDR4X-4266LPDDR5-5500
• 最大内存
  16 GB
• 记忆通道
  0 4
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Kompanio 1300T 和 Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Kompanio 1300T 和 Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L2-Cache
  -- 3.00 MB
• 建筑学
  Cortex-A78 / Cortex-A55 Kryo 585
• 技术过程
  6 nm 7 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q3/2021 Q2/2021
• Part Number
  MT8797 SM8250-AC