AMD A4-1200 versus HiSilicon Kirin 9000. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  AMD A HiSilicon Kirin
• Geração
  7 9
• Grupo CPU
  AMD A4-1000 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.00 GHz 2.05 GHz
• Núcleos de CPU
  2 8
• Turbo (1 núcleo)
  Sem turbo 3.13 GHz
• Roscas de CPU
  2 8
• Hyperthreading
  Não Não
• Overclocking
  Sim Não
• Arquitectura central
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  AMD Radeon HD 8180 ARM Mali-G78 MP24
• GPU frequency
  0.23 GHz 0.76 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  2 24
• Shader
  128 384
• Max. GPU Memory
  2 GB --
• Max. displays
  2 1
• Geração
  5 Vallhall 2
• DirectX Version
  11.1 12
• Processo técnico
  28 nm 5 nm
• Data de lançamento
  Q2/2013 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Não Decode / Encode
• h265 / HEVC (10 bit)
  Não Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Não Decode / Encode
• VP8
  Não Decode / Encode
• AV1
  Não Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 e AMD A4-1200. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  DDR3L-1066 SO-DIMM LPDDR4X-2133LPDDR5-2750
• ECC
  Não Não
• Canais de memória
  2 4

• AES-NI
  Sim Não

Analyze the TDP (Thermal Design Power) requirements of AMD A4-1200 e HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3.9 W

Information on architecture, interfaces, and additional instructions supported by AMD A4-1200 e HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  AMD-V None
• Extensões ISA
  SSE4a, SSE4.1, SSE4.2, AVX, FMA3, FMA4
• Кеш L3
  1.00 MB --
• Arquitectura
  Temash (Jaguar) Cortex-A77 / Cortex-A55
• Processo técnico
  28 nm 5 nm
• Socket
  FT3 N/A
• Data de lançamento
  Q2/2013 Q4/2020