AMD A4-1200 kontra HiSilicon Kirin 9000. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  AMD A HiSilicon Kirin
• Pokolenie
  7 9
• Grupa CPU
  AMD A4-1000 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.00 GHz 2.05 GHz
• Rdzenie CPU
  2 8
• Turbo (1 rdzeń)
  No turbo 3.13 GHz
• CPU Threads
  2 8
• Hyperthreading
  Nie Nie
• Overclocking
  Tak Nie
• Architektura podstawowa
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  AMD Radeon HD 8180 ARM Mali-G78 MP24
• GPU frequency
  0.23 GHz 0.76 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  2 24
• Shader
  128 384
• Max. GPU Memory
  2 GB --
• Max. displays
  2 1
• Pokolenie
  5 Vallhall 2
• DirectX Version
  11.1 12
• Proces technologiczny
  28 nm 5 nm
• Data wydania
  Q2/2013 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Nie Decode / Encode
• VP8
  Nie Decode / Encode
• AV1
  Nie Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 oraz AMD A4-1200. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR3L-1066 SO-DIMM LPDDR4X-2133LPDDR5-2750
• ECC
  Nie Nie
• Kanały pamięci
  2 4

• AES-NI
  Tak Nie

Analyze the TDP (Thermal Design Power) requirements of AMD A4-1200 oraz HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3.9 W

Information on architecture, interfaces, and additional instructions supported by AMD A4-1200 oraz HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  AMD-V None
• Rozszerzenia ISA
  SSE4a, SSE4.1, SSE4.2, AVX, FMA3, FMA4
• L3-Cache
  1.00 MB --
• Architektura
  Temash (Jaguar) Cortex-A77 / Cortex-A55
• Proces technologiczny
  28 nm 5 nm
• Gniazdo
  FT3 N/A
• Data wydania
  Q2/2013 Q4/2020