MediaTek Helio X30 vs Qualcomm Snapdragon 710. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Helio Qualcomm Snapdragon
• CPU group
  MediaTek Helio X30 Qualcomm Snapdragon 710
• Segment
  Mobile Mobile
• Generation
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 360 Gold
• B-Core
  4x Cortex-A53 6x Kryo 360 Silver
• C-Core
  4x Cortex-A35 --
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 616
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  0.85 GHz 0.75 GHz
• Execution units
  8 0
• Shader
  32 256
• Max. displays
  1 0
• Generation
  6
• Direct X
  12 12.1
• Technology
  10 10 nm
• Release date
  Q1/2016 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  No Decode
• VP8
  No Decode
• VP9
  No Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 710 and MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memory
  8 GB 8 GB
• Memory channels
  2 2
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 and Qualcomm Snapdragon 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 and Qualcomm Snapdragon 710, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architecture
  Cortex-A73 / -A53 / -A35 Kryo 360
• Technology
  10 nm 10 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q2/2017 Q2/2018
• Part Number
  MT6799 --