MediaTek Helio X30 vs Qualcomm Snapdragon 710. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Mediatek Helio Qualcomm Snapdragon
• CPU 그룹
  MediaTek Helio X30 Qualcomm Snapdragon 710
• 세그먼트
  Mobile Mobile
• 세대
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• 핵심 아키텍처
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 360 Gold
• B-Core
  4x Cortex-A53 6x Kryo 360 Silver
• C-Core
  4x Cortex-A35 --
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 616
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  0.85 GHz 0.75 GHz
• 실행 단위
  8 0
• Shader
  32 256
• Max. displays
  1 0
• 세대
  6
• Direct X
  12 12.1
• 기술
  10 10 nm
• 릴리스 날짜
  Q1/2016 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  아니요 Decode
• h265 / HEVC (10 bit)
  아니요 Decode
• h264
  아니요 Decode
• VP8
  아니요 Decode
• VP9
  아니요 Decode
• AV1
  아니요 아니요
• AVC
  아니요 Decode
• VC-1
  아니요 Decode
• JPEG
  아니요 Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 710 그리고 MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-1866 LPDDR4X-1866
• 최대. Memory
  8 GB 8 GB
• 메모리 채널
  2 2
• ECC
  아니요 아니요
• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 그리고 Qualcomm Snapdragon 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 그리고 Qualcomm Snapdragon 710, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 아키텍처
  Cortex-A73 / -A53 / -A35 Kryo 360
• 기술
  10 nm 10 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q2/2017 Q2/2018
• Part Number
  MT6799 --