MediaTek Helio X30 gegen Qualcomm Snapdragon 710. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Helio X30 Qualcomm Snapdragon 710
• Segment
  Mobile Mobile
• Generation
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 360 Gold
• B-Core
  4x Cortex-A53 6x Kryo 360 Silver
• C-Core
  4x Cortex-A35 --
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 616
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  0.85 GHz 0.75 GHz
• Ausführungseinheiten
  8 0
• Shader
  32 256
• Max. displays
  1 0
• Generation
  6
• Direct X
  12 12.1
• technisches verfahren
  10 10 nm
• Datum der Veröffentlichung
  Q1/2016 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode
• h265 / HEVC (10 bit)
  Nein Decode
• h264
  Nein Decode
• VP8
  Nein Decode
• VP9
  Nein Decode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Nein Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 710 und MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR4X-1866
• Max. Speicher
  8 GB 8 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 und Qualcomm Snapdragon 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 und Qualcomm Snapdragon 710, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Cortex-A73 / -A53 / -A35 Kryo 360
• technisches verfahren
  10 nm 10 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2017 Q2/2018
• Part Number
  MT6799 --