Qualcomm Snapdragon 888 vs MediaTek Helio X27. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Helio
• Generation
  8 2
• CPU group
  Qualcomm Snapdragon 888 MediaTek Helio X20

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 660 ARM Mali-T880 MP4
• GPU frequency
  0.84 GHz 0.88 GHz
• GPU (Turbo)
  No turbo 0.88 GHz
• Execution units
  0 4
• Shader
  0 64
• Max. displays
  0 2
• Generation
  6 Midgard 4
• Technology
  5 nm 16 nm
• Release date
  Q1/2021 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode No
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode No
• VC-1
  Decode No
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 and Qualcomm Snapdragon 888. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-4266LPDDR5-3200 LPDDR3-800
• Max. Memory
  4 GB
• ECC
  No No
• Memory channels
  4 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 888 and MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 888 and MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• L2-Cache
  1.00 MB --
• L3-Cache
  8.00 MB --
• Architecture
  Kryo 680 Cortex-A72 / Cortex-A53
• Technology
  5 nm 20 nm
• Socket
  N/A N/A
• Release date
  Q1/2021 Q1/2017
• Part Number
  -- MT6797X