Qualcomm Snapdragon 888 contre MediaTek Helio X27. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Qualcomm Snapdragon Mediatek Helio
• Génération
  8 2
• Groupe de CPU
  Qualcomm Snapdragon 888 MediaTek Helio X20

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  Non Non
• Architecture de base
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 660 ARM Mali-T880 MP4
• GPU frequency
  0.84 GHz 0.88 GHz
• GPU (Turbo)
  Pas de turbo 0.88 GHz
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 4
• Shader
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 64
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Génération
  6 Midgard 4
• Processus technologique
  5 nm 16 nm
• Date de sortie
  Q1/2021 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Non
• VP8
  Decode / Encode Decode / Encode
• AV1
  Non Non
• AVC
  Decode Non
• VC-1
  Decode Non
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 et Qualcomm Snapdragon 888. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-4266LPDDR5-3200 LPDDR3-800
• Max. Mémoire
  4 GB
• ECC
  Non Non
• Canaux de mémoire
  4 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 888 et MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 888 et MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Extensions ISA
  --
• L2-Cache
  1.00 MB --
• L3-Cache
  8.00 MB --
• Architecture
  Kryo 680 Cortex-A72 / Cortex-A53
• Processus technologique
  5 nm 20 nm
• Socket
  N/A N/A
• Date de sortie
  Q1/2021 Q1/2017
• Part Number
  -- MT6797X