Qualcomm Snapdragon 888 gegen MediaTek Helio X27. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Mediatek Helio
• Generation
  8 2
• CPU Gruppe
  Qualcomm Snapdragon 888 MediaTek Helio X20

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 660 ARM Mali-T880 MP4
• GPU frequency
  0.84 GHz 0.88 GHz
• GPU (Turbo)
  kein Turbo 0.88 GHz
• Ausführungseinheiten
  0 4
• Shader
  0 64
• Max. displays
  0 2
• Generation
  6 Midgard 4
• technisches verfahren
  5 nm 16 nm
• Datum der Veröffentlichung
  Q1/2021 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Nein
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 und Qualcomm Snapdragon 888. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-4266LPDDR5-3200 LPDDR3-800
• Max. Speicher
  4 GB
• ECC
  Nein Nein
• Speicherkanäle
  4 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 888 und MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 888 und MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• ISA-Erweiterungen
  --
• L2-Cache
  1.00 MB --
• L3-Cache
  8.00 MB --
• Architektur
  Kryo 680 Cortex-A72 / Cortex-A53
• technisches verfahren
  5 nm 20 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2021 Q1/2017
• Part Number
  -- MT6797X