Qualcomm Snapdragon 888 kontra MediaTek Helio X27. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Mediatek Helio
• Pokolenie
  8 2
• Grupa CPU
  Qualcomm Snapdragon 888 MediaTek Helio X20

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 660 ARM Mali-T880 MP4
• GPU frequency
  0.84 GHz 0.88 GHz
• GPU (Turbo)
  No turbo 0.88 GHz
• Jednostki wykonawcze
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 4
• Shader
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 64
• Max. displays
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• Pokolenie
  6 Midgard 4
• Proces technologiczny
  5 nm 16 nm
• Data wydania
  Q1/2021 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Nie
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode Nie
• VC-1
  Decode Nie
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 oraz Qualcomm Snapdragon 888. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-4266LPDDR5-3200 LPDDR3-800
• Max. Pamięć
  4 GB
• ECC
  Nie Nie
• Kanały pamięci
  4 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 888 oraz MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 888 oraz MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Rozszerzenia ISA
  --
• L2-Cache
  1.00 MB --
• L3-Cache
  8.00 MB --
• Architektura
  Kryo 680 Cortex-A72 / Cortex-A53
• Proces technologiczny
  5 nm 20 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2021 Q1/2017
• Part Number
  -- MT6797X