HiSilicon Kirin 810 gegen Qualcomm Snapdragon 750G. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  6 3
• CPU Gruppe
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 750

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.90 GHz 1.80 GHz
• Turbo (1 Kern)
  2.20 GHz 2.20 GHz
• Turbo (8 Cores)
  2.20 GHz 2.20 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G52 MP6 Qualcomm Adreno 619
• GPU frequency
  0.85 GHz 0.95 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  16 0
• Shader
  288 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Bifrost 2 6
• technisches verfahren
  12 nm 8 nm
• Datum der Veröffentlichung
  Q1/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Nein Nein
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 750G und HiSilicon Kirin 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR4X-2133
• Max. Speicher
  6 GB 8 GB
• ECC
  Nein Nein
• Speicherkanäle
  4 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 810 und Qualcomm Snapdragon 750G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 810 und Qualcomm Snapdragon 750G, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L3-Cache
  1.00 MB --
• Architektur
  Cortex-A76 / Cortex-A55 Kryo 570
• technisches verfahren
  7 nm 8 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2019 Q4/2020
• Part Number
  -- SM7225