Qualcomm Snapdragon 888 Plus gegen Qualcomm Snapdragon 662. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generation
  8 7
• CPU Gruppe
  Qualcomm Snapdragon 888 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.80 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  3.00 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.42 GHz 1.80 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 680 Prime 4x Kryo 260 Gold
• B core
  3x Kryo 680 Gold 4x Kryo 260 Silver
• C core
  4x Kryo 680 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 660 Qualcomm Adreno 610
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Shader
  0 128
• Max. GPU Memory
  -- 4 GB
• Generation
  6 6
• DirectX Version
  12.1 12.1
• technisches verfahren
  5 nm 11 nm
• Datum der Veröffentlichung
  Q1/2021 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Nein Nein
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 662 und Qualcomm Snapdragon 888 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR5-3200 LPDDR3-933LPDDR4X-1866
• ECC
  Nein Nein
• Speicherkanäle
  4 2

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 888 Plus und Qualcomm Snapdragon 662 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 888 Plus und Qualcomm Snapdragon 662, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L2-Cache
  4.00 MB --
• L3-Cache
  4.00 MB --
• Architektur
  Kryo 680 Kryo 260
• technisches verfahren
  5 nm 11 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2021 Q1/2020
• Part Number
  SM8350-AC SM6115