Qualcomm Snapdragon 888 Plus
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Q3/2021
Qualcomm Snapdragon 888 Plus

Prozessor Qualcomm Snapdragon 888 Plus, Spezifikationen und Benchmarks

Der Qualcomm Snapdragon 888 Plus Prozessor wird in N/A Sockel-Platinen installiert und arbeitet mit einer Frequenz von 1.80 GHz. Der Qualcomm Snapdragon 888 Plus hat insgesamt 8 Kerne. Erscheinungsdatum: Q3/2021. TDP beträgt . Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum Qualcomm Snapdragon 888 Plus Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf Qualcomm Snapdragon 888 Plus laufen.

Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Mobile
  • Serie
  • Generation
    8
  • CPU Gruppe
    Qualcomm Snapdragon 888
  • Vergangenes Modell
    --
  • Successor
    --
CPU Technical Specs

Qualcomm Snapdragon 888 Plus. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequenz
    1.80 GHz
  • CPU Kerne
    8
  • Turbo (1 Kern)
    3.00 GHz
  • CPU Threads
    8
  • Turbo (8 Cores)
    2.42 GHz
  • Hyperthreading
    Nein
  • Übertaktung
    Nein
  • Zentrale Architektur
    hybrid (Prime / big.LITTLE)
  • A core
    1x Kryo 680 Prime
  • B core
    3x Kryo 680 Gold
  • C core
    4x Kryo 680 Silver
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    Qualcomm Adreno 660
  • GPU frequency
    0.84 GHz
  • GPU (Turbo)
    kein Turbo
  • Ausführungseinheiten
    0
  • Shader
    0
  • Max. GPU Memory
    --
  • Max. displays
    0
  • Generation
    6
  • DirectX Version
    12.1
  • technisches verfahren
    5 nm
  • Datum der Veröffentlichung
    Q1/2021
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    Nein
  • AVC
    Decode
  • VC-1
    Decode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    LPDDR5-3200
  • Max. Speicher
  • ECC
    Nein
  • Speicherkanäle
    4
  • PCIe-Version
  • PCIe-Lanes
Verschlüsselung

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Nein
Energieverbrauch
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Maximale Temperatur
    --
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Befehlssatz (ISA)
    ARMv8-A64 (64 bit)
  • Virtualisierung
    None
  • ISA-Erweiterungen
  • L2-Cache
    4.00 MB
  • L3-Cache
    4.00 MB
  • Architektur
    Kryo 680
  • technisches verfahren
    5 nm
  • Steckdose
    N/A
  • Datum der Veröffentlichung
    Q3/2021
  • Part Number
    SM8350-AC
Positionen in allen Ranglisten

Gemeinsame Standpunkte Qualcomm Snapdragon 888 Plus CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    155 place

Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of Qualcomm Snapdragon 888 Plus with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Synonyme

Ähnliche Prozessoren in Bezug auf die Leistung.

Ähnlich bei technischen Datenverarbeitern mit Qualcomm Snapdragon 888 Plus.

AMD A6-9220C Siehe
AMD A10-8700P Siehe
AMD A8-7100 Siehe
AMD A9-9420e Siehe
AMD A8-3510MX Siehe
AMD E2-3300M Siehe
AMD Ryzen 7 5700U Siehe
AMD Ryzen 7 4800U Siehe

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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Qualcomm Snapdragon 888 Plus

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