AMD Ryzen Embedded V1807B vs AMD Sempron 2650. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Family
  AMD Ryzen Embedded AMD Sempron
• Generation
  1 1
• CPU group
  AMD Ryzen Embedded V1000 AMD Sempron 2000/3000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  3.35 GHz 1.45 GHz
• CPU Cores
  4 2
• Turbo (1 Core)
  3.80 GHz No turbo
• CPU Threads
  8 2
• Hyperthreading
  Yes No
• Overclocking
  No Yes
• Core architecture
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  AMD Radeon Vega 11 Graphics AMD Radeon HD 8240
• GPU frequency
  1.30 GHz 0.40 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  11 2
• Shader
  704 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 2
• Generation
  8 5
• DirectX Version
  12 11.1
• Technology
  14 nm 28 nm
• Release date
  Q1/2018 Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Sempron 2650 and AMD Ryzen Embedded V1807B. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  DDR4-3200 DDR3L-1333 SO-DIMM
• Max. Memory
  32 GB
• ECC
  Yes No
• Memory channels
  2 1
• PCIe version
  3.0
• PCIe lanes
  16

• AES-NI
  Yes Yes

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V1807B and AMD Sempron 2650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 25 W
• TDP up
  54 W --
• TDP down
  35 W --
• Tjunction max.
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V1807B and AMD Sempron 2650, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  AMD-V, SVM AMD-V
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  4.00 MB 1.00 MB
• Architecture
  Great Horned Owl (Zen) Kabini (Jaguar)
• Technology
  14 nm 28 nm
• Socket
  FP5 AM1
• Release date
  Q1/2018 Q2/2014