AMD Ryzen Embedded V1807B vs AMD Sempron 2650. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Desktop / Server Desktop / Server
• 가족
  AMD Ryzen Embedded AMD Sempron
• 세대
  1 1
• CPU 그룹
  AMD Ryzen Embedded V1000 AMD Sempron 2000/3000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  3.35 GHz 1.45 GHz
• CPU 코어
  4 2
• Turbo (1 Core)
  3.80 GHz 터보 없음
• CPU 스레드
  8 2
• Hyperthreading
  예 아니요
• 오버클러킹
  아니요 예
• 핵심 아키텍처
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  AMD Radeon Vega 11 Graphics AMD Radeon HD 8240
• GPU frequency
  1.30 GHz 0.40 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  11 2
• Shader
  704 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 2
• 세대
  8 5
• DirectX Version
  12 11.1
• 기술
  14 nm 28 nm
• 릴리스 날짜
  Q1/2018 Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode 아니요
• h265 / HEVC (10 bit)
  Decode / Encode 아니요
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode 아니요
• VP8
  Decode / Encode 아니요
• AV1
  아니요 아니요
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Sempron 2650 그리고 AMD Ryzen Embedded V1807B. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  DDR4-3200 DDR3L-1333 SO-DIMM
• 최대. Memory
  32 GB
• ECC
  예 아니요
• 메모리 채널
  2 1
• PCIe 버전
  3.0
• PCIe 레인
  16

• AES-NI
  예 예

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V1807B 그리고 AMD Sempron 2650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 25 W
• TDP up
  54 W --
• TDP down
  35 W --
• 최대 접합.
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V1807B 그리고 AMD Sempron 2650, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• 가상화
  AMD-V, SVM AMD-V
• ISA 확장
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  4.00 MB 1.00 MB
• 아키텍처
  Great Horned Owl (Zen) Kabini (Jaguar)
• 기술
  14 nm 28 nm
• 소켓
  FP5 AM1
• 릴리스 날짜
  Q1/2018 Q2/2014