AMD Ryzen Embedded V1807B gegen AMD Sempron 2650. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Serie
  AMD Ryzen Embedded AMD Sempron
• Generation
  1 1
• CPU Gruppe
  AMD Ryzen Embedded V1000 AMD Sempron 2000/3000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  3.35 GHz 1.45 GHz
• CPU Kerne
  4 2
• Turbo (1 Kern)
  3.80 GHz kein Turbo
• CPU Threads
  8 2
• Hyperthreading
  Ja Nein
• Übertaktung
  Nein Ja
• Zentrale Architektur
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  AMD Radeon Vega 11 Graphics AMD Radeon HD 8240
• GPU frequency
  1.30 GHz 0.40 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  11 2
• Shader
  704 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 2
• Generation
  8 5
• DirectX Version
  12 11.1
• technisches verfahren
  14 nm 28 nm
• Datum der Veröffentlichung
  Q1/2018 Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nein
• h265 / HEVC (10 bit)
  Decode / Encode Nein
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Nein
• VP8
  Decode / Encode Nein
• AV1
  Nein Nein
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Sempron 2650 und AMD Ryzen Embedded V1807B. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  DDR4-3200 DDR3L-1333 SO-DIMM
• Max. Speicher
  32 GB
• ECC
  Ja Nein
• Speicherkanäle
  2 1
• PCIe-Version
  3.0
• PCIe-Lanes
  16

• AES-NI
  Ja Ja

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V1807B und AMD Sempron 2650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 25 W
• TDP up
  54 W --
• TDP down
  35 W --
• Maximale Temperatur
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V1807B und AMD Sempron 2650, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualisierung
  AMD-V, SVM AMD-V
• ISA-Erweiterungen
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  4.00 MB 1.00 MB
• Architektur
  Great Horned Owl (Zen) Kabini (Jaguar)
• technisches verfahren
  14 nm 28 nm
• Steckdose
  FP5 AM1
• Datum der Veröffentlichung
  Q1/2018 Q2/2014