MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Dimensity Qualcomm Snapdragon
• CPU group
  MediaTek Dimensity 8000 Qualcomm Snapdragon 888
• Segment
  Mobile Mobile
• Generation
  3 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G610 MP6 Qualcomm Adreno 660
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  6 0
• Max. displays
  1 0
• Generation
  Vallhall 3 6
• Technology
  4 nm 5 nm
• Release date
  Q2/2021 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 and MediaTek Dimensity 8100. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR5-6400 LPDDR4X-4266LPDDR5-3200
• Memory channels
  4 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8100 and Qualcomm Snapdragon 888 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8100 and Qualcomm Snapdragon 888, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 8.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo 680
• Technology
  5 nm 5 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q1/2021