MediaTek Dimensity 8100 gegen Qualcomm Snapdragon 888. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Dimensity Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Dimensity 8000 Qualcomm Snapdragon 888
• Segment
  Mobile Mobile
• Generation
  3 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G610 MP6 Qualcomm Adreno 660
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  6 0
• Max. displays
  1 0
• Generation
  Vallhall 3 6
• technisches verfahren
  4 nm 5 nm
• Datum der Veröffentlichung
  Q2/2021 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Nein
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 und MediaTek Dimensity 8100. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR5-6400 LPDDR4X-4266LPDDR5-3200
• Speicherkanäle
  4 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8100 und Qualcomm Snapdragon 888 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8100 und Qualcomm Snapdragon 888, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 8.00 MB
• Architektur
  Cortex-A78 / Cortex-A55 Kryo 680
• technisches verfahren
  5 nm 5 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2022 Q1/2021