MediaTek Dimensity 930 vs Qualcomm Snapdragon 8 Gen 1. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Dimensity Qualcomm Snapdragon
• CPU group
  MediaTek Dimensity 900 Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Generation
  2 1
• Predecessor
  -- Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  2x Cortex-A78 1x Cortex-X2
• B-Core
  6x Cortex-A55 3x Cortex-A710
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  PowerVR IMG AXM-8-256 Qualcomm Adreno 730
• GPU frequency
  1.00 GHz 0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  8 0
• Generation
  10 7
• Direct X
  -- 12.1
• Technology
  0 4 nm
• Release date
  Q4/2019 Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 and MediaTek Dimensity 930. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR5-6400 LPDDR5-3200
• Max. Memory
  16 GB 16 GB
• Memory channels
  4 (Quad Channel) 4
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 930 and Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 930 and Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• Technology
  6 nm 4 nm
• Socket
  -- N/A
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• Release date
  Q3/2022 Q1/2022
• Part Number
  MT6878 SM8450