MediaTek Dimensity 930 対 Qualcomm Snapdragon 8 Gen 1. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Mediatek Dimensity Qualcomm Snapdragon
• CPUグループ
  MediaTek Dimensity 900 Qualcomm Snapdragon 8 Gen 1
• セグメント
  Mobile Mobile
• 世代
  2 1
• 過去のモデル
  -- Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  2x Cortex-A78 1x Cortex-X2
• B-Core
  6x Cortex-A55 3x Cortex-A710
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  PowerVR IMG AXM-8-256 Qualcomm Adreno 730
• GPU frequency
  1.00 GHz 0.84 GHz
• GPU (Turbo)
  ターボなし ターボなし
• 実行部隊
  8 0
• 世代
  10 7
• Direct X
  -- 12.1
• ぎじゅつてきなかだい
  0 4 nm
• 発売日
  Q4/2019 Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  いいえ Decode / Encode
• VP9
  いいえ Decode / Encode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode
• VC-1
  いいえ Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 と MediaTek Dimensity 930. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR5-6400 LPDDR5-3200
• マックス メモリ
  16 GB 16 GB
• メモリーチャンネル
  4 (Quad Channel) 4
• ECC
  いいえ いいえ
• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 930 と Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 930 と Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• ぎじゅつてきなかだい
  6 nm 4 nm
• ソケット
  -- N/A
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• 建築
  Cortex-A78 / Cortex-A55 Kryo
• 仮想化
  None None
• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• 発売日
  Q3/2022 Q1/2022
• Part Number
  MT6878 SM8450