MediaTek Dimensity 930 对 Qualcomm Snapdragon 8 Gen 1. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Mediatek Dimensity Qualcomm Snapdragon
• CPU组
  MediaTek Dimensity 900 Qualcomm Snapdragon 8 Gen 1
• 分段
  Mobile Mobile
• 一代人
  2 1
• 过去的模式
  -- Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• 核心架构
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  2x Cortex-A78 1x Cortex-X2
• B-Core
  6x Cortex-A55 3x Cortex-A710
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  PowerVR IMG AXM-8-256 Qualcomm Adreno 730
• GPU frequency
  1.00 GHz 0.84 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  8 0
• 一代人
  10 7
• Direct X
  -- 12.1
• 技术过程
  0 4 nm
• 发布日期
  Q4/2019 Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  没有 Decode / Encode
• VP9
  没有 Decode / Encode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 和 MediaTek Dimensity 930. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR5-6400 LPDDR5-3200
• 最大内存
  16 GB 16 GB
• 记忆通道
  4 (Quad Channel) 4
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 930 和 Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 930 和 Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• 技术过程
  6 nm 4 nm
• 插座
  -- N/A
• L2-Cache
  -- 2.00 MB
• L2-Cache
  -- 4.00 MB
• 建筑学
  Cortex-A78 / Cortex-A55 Kryo
• 虚拟化
  None None
• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• 发布日期
  Q3/2022 Q1/2022
• Part Number
  MT6878 SM8450