Qualcomm Snapdragon 810 vs HiSilicon Kirin 960. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Qualcomm Snapdragon HiSilicon Kirin
• CPU group
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• Segment
  Mobile Mobile
• Generation
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequency
  1.50 GHz 1.80 GHz
• Turbo (1 Core)
  2.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Execution units
  0 8
• Shader
  256 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 2
• Generation
  4 Bifrost 1
• Technology
  20 nm 16 nm
• Release date
  Q2/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  Decode No
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 and Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4-1600 LPDDR4-1600
• Max. Memory
  6 GB
• Memory channels
  2 2
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 and HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 and HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Technology
  20 nm 16 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q3/2014 Q4/2016
• Part Number
  MSM8994 --