Qualcomm Snapdragon 810 contre HiSilicon Kirin 960. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon HiSilicon Kirin
• Groupe de CPU
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• Segment
  Mobile Mobile
• Génération
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Fréquence
  1.50 GHz 1.80 GHz
• Turbo (1 cœur)
  2.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz Pas de turbo
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 8
• Shader
  256 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Génération
  4 Bifrost 1
• Processus technologique
  20 nm 16 nm
• Date de sortie
  Q2/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Non Decode / Encode
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Decode / Encode
• VC-1
  Decode Non
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 et Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4-1600 LPDDR4-1600
• Max. Mémoire
  6 GB
• Canaux de mémoire
  2 2
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 et HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 et HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Processus technologique
  20 nm 16 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q3/2014 Q4/2016
• Part Number
  MSM8994 --