Qualcomm Snapdragon 810 contro HiSilicon Kirin 960. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon HiSilicon Kirin
• Gruppo CPU
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• Segmento
  Mobile Mobile
• Generazione
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenza
  1.50 GHz 1.80 GHz
• Turbo (1 Core)
  2.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Unità di esecuzione
  0 8
• Shader
  256 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 2
• Generazione
  4 Bifrost 1
• Processo tecnico
  20 nm 16 nm
• Data di rilascio
  Q2/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  Decode No
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 e Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4-1600 LPDDR4-1600
• Max. Memoria
  6 GB
• Canali di memoria
  2 2
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 e HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 e HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 4.00 MB
• Architettura
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Processo tecnico
  20 nm 16 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q3/2014 Q4/2016
• Part Number
  MSM8994 --