MediaTek Helio X30 contra Qualcomm Snapdragon 730G. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Qualcomm Snapdragon
• Grupo CPU
  MediaTek Helio X30 Qualcomm Snapdragon 730
• Segmento
  Mobile Mobile
• Generación
  3 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• Arquitectura del núcleo
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 470 Gold
• B-Core
  4x Cortex-A53 6x Kryo 470 Silver
• C-Core
  4x Cortex-A35 --
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 618
• GPU frequency
  0.85 GHz 0.83 GHz
• GPU (Turbo)
  0.85 GHz sin turbo
• Unidades de ejecución
  8 0
• Shader
  32 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generación
  6
• Direct X
  12 12.1
• Proceso técnico
  10 14 nm
• Fecha de publicación
  Q1/2016 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  No Decode / Encode
• VP8
  No Decode
• VP9
  No Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 730G y MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memoria
  8 GB 8 GB
• Canales de memoria
  2 2
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 y Qualcomm Snapdragon 730G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 y Qualcomm Snapdragon 730G, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Arquitectura
  Cortex-A73 / -A53 / -A35 Kryo 470 Gold/475 Silver
• Proceso técnico
  10 nm 8 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q2/2017 Q2/2019
• Part Number
  MT6799 SM7150-AB