MediaTek Helio X30 対 Qualcomm Snapdragon 730G. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Mediatek Helio Qualcomm Snapdragon
• CPUグループ
  MediaTek Helio X30 Qualcomm Snapdragon 730
• セグメント
  Mobile Mobile
• 世代
  3 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• コア・アーキテクチャ
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 470 Gold
• B-Core
  4x Cortex-A53 6x Kryo 470 Silver
• C-Core
  4x Cortex-A35 --
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 618
• GPU frequency
  0.85 GHz 0.83 GHz
• GPU (Turbo)
  0.85 GHz ターボなし
• 実行部隊
  8 0
• シェーダー
  32 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• 世代
  6
• Direct X
  12 12.1
• ぎじゅつてきなかだい
  10 14 nm
• 発売日
  Q1/2016 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  いいえ Decode
• h265 / HEVC (10 bit)
  いいえ Decode
• h264
  いいえ Decode / Encode
• VP8
  いいえ Decode
• VP9
  いいえ Decode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode
• VC-1
  いいえ Decode
• JPEG
  いいえ Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 730G と MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1866 LPDDR4X-1866
• マックス メモリ
  8 GB 8 GB
• メモリーチャンネル
  2 2
• ECC
  いいえ いいえ
• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 と Qualcomm Snapdragon 730G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 と Qualcomm Snapdragon 730G, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建築
  Cortex-A73 / -A53 / -A35 Kryo 470 Gold/475 Silver
• ぎじゅつてきなかだい
  10 nm 8 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q2/2017 Q2/2019
• Part Number
  MT6799 SM7150-AB