MediaTek Helio X30 对 Qualcomm Snapdragon 730G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Mediatek Helio Qualcomm Snapdragon
• CPU组
  MediaTek Helio X30 Qualcomm Snapdragon 730
• 分段
  Mobile Mobile
• 一代人
  3 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 470 Gold
• B-Core
  4x Cortex-A53 6x Kryo 470 Silver
• C-Core
  4x Cortex-A35 --
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 618
• GPU frequency
  0.85 GHz 0.83 GHz
• GPU (Turbo)
  0.85 GHz 没有涡轮增压
• 执行单位
  8 0
• 着色器
  32 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• 一代人
  6
• Direct X
  12 12.1
• 技术过程
  10 14 nm
• 发布日期
  Q1/2016 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 Decode
• h265 / HEVC (10 bit)
  没有 Decode
• h264
  没有 Decode / Encode
• VP8
  没有 Decode
• VP9
  没有 Decode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 730G 和 MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-1866 LPDDR4X-1866
• 最大内存
  8 GB 8 GB
• 记忆通道
  2 2
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 和 Qualcomm Snapdragon 730G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 和 Qualcomm Snapdragon 730G, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建筑学
  Cortex-A73 / -A53 / -A35 Kryo 470 Gold/475 Silver
• 技术过程
  10 nm 8 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q2/2017 Q2/2019
• Part Number
  MT6799 SM7150-AB