MediaTek Dimensity 9000 Plus contro HiSilicon Kirin 990 5G. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Dimensity HiSilicon Kirin
• Gruppo CPU
  MediaTek Dimensity 9000 HiSilicon Kirin 990
• Segmento
  Mobile Mobile
• Generazione
  3 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-G710 MP10 ARM Mali-G76 MP16
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  10 16
• Shader
  0 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generazione
  Vallhall 3 Bifrost 3
• Processo tecnico
  4 nm 7 nm
• Data di rilascio
  Q2/2021 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 5G e MediaTek Dimensity 9000 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR5-7500 LPDDR4X-4266
• Max. Memoria
  8 GB
• Canali di memoria
  4 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 9000 Plus e HiSilicon Kirin 990 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 9000 Plus e HiSilicon Kirin 990 5G, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 2.00 MB
• Architettura
  Cortex-X2 / -A710 / -A510 Cortex-A76 / Cortex-A55
• Processo tecnico
  4 nm 7 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q3/2022 Q3/2019
• Part Number
  MT6983 --