MediaTek Dimensity 9000 Plus kontra HiSilicon Kirin 990 5G. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Dimensity HiSilicon Kirin
• Grupa CPU
  MediaTek Dimensity 9000 HiSilicon Kirin 990
• Segment
  Mobile Mobile
• Pokolenie
  3 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G710 MP10 ARM Mali-G76 MP16
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  10 16
• Shader
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Pokolenie
  Vallhall 3 Bifrost 3
• Proces technologiczny
  4 nm 7 nm
• Data wydania
  Q2/2021 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Nie
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 5G oraz MediaTek Dimensity 9000 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR5-7500 LPDDR4X-4266
• Max. Pamięć
  8 GB
• Kanały pamięci
  4 4
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 9000 Plus oraz HiSilicon Kirin 990 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 9000 Plus oraz HiSilicon Kirin 990 5G, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 2.00 MB
• Architektura
  Cortex-X2 / -A710 / -A510 Cortex-A76 / Cortex-A55
• Proces technologiczny
  4 nm 7 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2022 Q3/2019
• Part Number
  MT6983 --