MediaTek Dimensity 9000 Plus gegen HiSilicon Kirin 990 5G. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Dimensity HiSilicon Kirin
• CPU Gruppe
  MediaTek Dimensity 9000 HiSilicon Kirin 990
• Segment
  Mobile Mobile
• Generation
  3 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G710 MP10 ARM Mali-G76 MP16
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  10 16
• Shader
  0 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  Vallhall 3 Bifrost 3
• technisches verfahren
  4 nm 7 nm
• Datum der Veröffentlichung
  Q2/2021 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Nein
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 5G und MediaTek Dimensity 9000 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR5-7500 LPDDR4X-4266
• Max. Speicher
  8 GB
• Speicherkanäle
  4 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 9000 Plus und HiSilicon Kirin 990 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 9000 Plus und HiSilicon Kirin 990 5G, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 2.00 MB
• Architektur
  Cortex-X2 / -A710 / -A510 Cortex-A76 / Cortex-A55
• technisches verfahren
  4 nm 7 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2022 Q3/2019
• Part Number
  MT6983 --