MediaTek MT8766B contro HiSilicon Kirin 710. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek MT-Serie HiSilicon Kirin
• Gruppo CPU
  MediaTek MT87xx 12nm HiSilicon Kirin 710
• Segmento
  Mobile Mobile
• Generazione
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  normal hybrid (big.LITTLE)
• Overclock
  No No
• Frequenza
  2.00 GHz 1.70 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  PowerVR GE8300 ARM Mali-G51 MP4
• GPU frequency
  0.01 GHz 0.65 GHz
• GPU (Turbo)
  No turbo 1.00 GHz
• Unità di esecuzione
  1 8
• Shader
  0 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generazione
  Bifrost 1
• Processo tecnico
  20 nm 12 nm
• Data di rilascio
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No No
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 710 e MediaTek MT8766B. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3LPDDR4 LPDDR3LPDDR4
• Max. Memoria
  6 GB
• Canali di memoria
  0 2
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek MT8766B e HiSilicon Kirin 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek MT8766B e HiSilicon Kirin 710, including virtual machine technologies and fabrication processes.

• Processo tecnico
  12 nm 12 nm
• Presa
  -- N/A
• L2-Cache
  1.00 MB --
• L3-Cache
  -- 1.00 MB
• Architettura
  Cortex-A53 Cortex-A73 / Cortex-A53
• Virtualizzazione
  None None
• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Data di rilascio
  Q2/2020 Q3/2018