MediaTek MT8766B gegen HiSilicon Kirin 710. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek MT-Serie HiSilicon Kirin
• CPU Gruppe
  MediaTek MT87xx 12nm HiSilicon Kirin 710
• Segment
  Mobile Mobile
• Generation
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  normal hybrid (big.LITTLE)
• Übertaktung
  Nein Nein
• Frequenz
  2.00 GHz 1.70 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR GE8300 ARM Mali-G51 MP4
• GPU frequency
  0.01 GHz 0.65 GHz
• GPU (Turbo)
  kein Turbo 1.00 GHz
• Ausführungseinheiten
  1 8
• Shader
  0 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  Bifrost 1
• technisches verfahren
  20 nm 12 nm
• Datum der Veröffentlichung
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Nein Decode / Encode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 710 und MediaTek MT8766B. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3LPDDR4 LPDDR3LPDDR4
• Max. Speicher
  6 GB
• Speicherkanäle
  0 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek MT8766B und HiSilicon Kirin 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek MT8766B und HiSilicon Kirin 710, including virtual machine technologies and fabrication processes.

• technisches verfahren
  12 nm 12 nm
• Steckdose
  -- N/A
• L2-Cache
  1.00 MB --
• L3-Cache
  -- 1.00 MB
• Architektur
  Cortex-A53 Cortex-A73 / Cortex-A53
• Virtualisierung
  None None
• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Datum der Veröffentlichung
  Q2/2020 Q3/2018