MediaTek MT8766B kontra HiSilicon Kirin 710. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek MT-Serie HiSilicon Kirin
• Grupa CPU
  MediaTek MT87xx 12nm HiSilicon Kirin 710
• Segment
  Mobile Mobile
• Pokolenie
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  normal hybrid (big.LITTLE)
• Overclocking
  Nie Nie
• Częstotliwość
  2.00 GHz 1.70 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  PowerVR GE8300 ARM Mali-G51 MP4
• GPU frequency
  0.01 GHz 0.65 GHz
• GPU (Turbo)
  No turbo 1.00 GHz
• Jednostki wykonawcze
  1 8
• Shader
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Pokolenie
  Bifrost 1
• Proces technologiczny
  20 nm 12 nm
• Data wydania
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Nie Decode / Encode
• VP8
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Nie Decode / Encode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 710 oraz MediaTek MT8766B. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3LPDDR4 LPDDR3LPDDR4
• Max. Pamięć
  6 GB
• Kanały pamięci
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek MT8766B oraz HiSilicon Kirin 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek MT8766B oraz HiSilicon Kirin 710, including virtual machine technologies and fabrication processes.

• Proces technologiczny
  12 nm 12 nm
• Gniazdo
  -- N/A
• L2-Cache
  1.00 MB --
• L3-Cache
  -- 1.00 MB
• Architektura
  Cortex-A53 Cortex-A73 / Cortex-A53
• Wirtualizacja
  None None
• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Data wydania
  Q2/2020 Q3/2018