UNISOC T310 contro UNISOC T616. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  UNISOC 4G UNISOC 4G
• Gruppo CPU
  UNISOC 4G 12nm UNISOC 4G 12nm
• Segmento
  Mobile Mobile
• Generazione
  0 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Cortex-A75 2x Cortex-A75
• B-Core
  3x Cortex-A55 6x Cortex-A55
• Hyperthreading / SMT
  No No
• Overclock
  No No
• A-Core Frequency
  2.00 GHz 2.00 GHz
• B-Core Frequency
  1.80 GHz 1.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  PowerVR GE8300 ARM Mali-G57 MP1
• GPU frequency
  0.80 GHz 0.75 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  1 2
• Shader
  0 32
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generazione
  Vallhall 1
• Direct X
  10 12
• Processo tecnico
  20 nm 7 nm
• Data di rilascio
  Q1/2017 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by UNISOC T616 e UNISOC T310. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3-933LPDDR4-1333LPDDR4X-1333 LPDDR4X-1866
• Max. Memoria
  --
• Canali di memoria
  0 --
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T310 e UNISOC T616 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1 / PBP)
  --

Information on architecture, interfaces, and additional instructions supported by UNISOC T310 e UNISOC T616, including virtual machine technologies and fabrication processes.

• Processo tecnico
  12 nm 12 nm
• Chip design
  --
• Architettura
  --
• Operating systems
  Android Android
• Virtualizzazione
  None None
• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Estensioni ISA
  --
• Data di rilascio
  Q2/2019 Q3/2021
• Specifica
  Technical data sheet Technical data sheet